In recent years, laser cutting has rapidly replaced mechanical equipment cutting for silicon wafer cutting. Choosing laser cutting is more conducive to improving the qualification rate and mass production of chip cutting, while mechanical equipment has low cutting efficiency, large edge explosion, high cost of consumables such as blade wheels and cutting fluid, and high equipment maintenance costs.

In the field of glass processing, traditional mechanical drilling methods are gradually unable to meet the high standard requirements of modern industry due to their slow processing speed, low accuracy, and potential pollution and damage problems. However, with the advancement of technology, glass laser drilling machines are gradually becoming the top equipment in the glass processing industry due to their excellent performance and unique advantages.