Silicon wafer laser cutting

2025-11-07 15:13:59

In recent years, laser cutting has rapidly replaced mechanical equipment cutting for silicon wafer cutting. Choosing laser cutting is more conducive to improving the qualification rate and mass production of chip cutting, while mechanical equipment has low cutting efficiency, large edge explosion, high cost of consumables such as blade wheels and cutting fluid, and high equipment maintenance costs. Laser cutting is a non-contact production process that has many advantages that mechanical manufacturing does not have. Laser cutting has the advantages of environmental protection, high work efficiency, and small edge explosion. Laser cutting is popular in terms of technical aspects, including hidden cutting and dissolution cutting.

For different silicon wafer materials, due to their different characteristics, the specifications for laser cutting equipment are also different. Therefore, the laser processing technology needs to be tailored according to the actual situation and find the best solution. Laser cutting processing uses laser photons as the kinetic energy medium. Based on the interaction between laser and materials, a series of physical and chemical reactions are caused in the production and processing of materials, in order to achieve professional techniques such as cutting, drilling, etching, and other processing methods for materials. After the laser is focused by expanding the beam, a layer of several micrometers of focusing point is formed on the surface of the material, which can be flexibly cut by coordinating with the service platform.

The key components of the laser cutting system include the laser system, laser optical path transmission system, laser focusing system, imaging precision positioning system, motion control system, etc. The fully automatic equipment also includes an automatic feeding system. The laser system mainly includes a laser, which contains a laser cutting head, a control cabinet, and a water cooler (the fiber line laser part is air-cooled). Currently, the mainstream lasers are semiconductor material low-temperature pump solid-state lasers and their fiber line lasers. The wavelength of light is mostly 1064nm for infrared, 532nm for green, and 355nm for ultraviolet. The laser optical path transmission system mainly includes beam expansion system, transmission system, aperture, etc. The key to the beam expansion system is a fixed or variable magnification beam expansion mirror, which is used to change the size of the laser output light spot and reduce the scattering angle of the light spot. The laser transmission system is usually a 45 degree transmission mirror or a 0-degree reflection mirror, and the reflection mirror is selected with excellent performance crystal plating to ensure that the laser output power loss is minimized. The collaborative molecular thermal motion service platform drives the spotlight, and the hidden cutting focuses on the beam of light located within the internal structure of the material to complete the cutting. The dissolution cutting focuses on the beam of light gradually transforming from the surface downwards, and then cutting around the material from top to bottom.