Laser glass cutting and cracking machine

Introduction:

This device is designed for the brittle and hard characteristics of glass, using ultra fast laser and Bessel cutting head for non-destructive processing of glass. It can achieve um level edge breakage, high cutting efficiency, and no taper.

Advantages:

Equipped with high-quality picosecond infrared laser and Bessel cutting head as standard, it can perform * * cutting of brittle transparent materials;

Wide range of applicable materials, compatible with transparent glass of different materials;

High machining accuracy, edge chipping<5um, no taper;

Matching CO2 fragmentation system, integrated cutting and fragmentation operation, significantly improving efficiency;

Customized optical path system to ensure high-quality laser transmission and improve processing stability;

L can be customized non compliantly, integrating functions such as automatic loading and unloading, multiple workstations, visual positioning, and MES information docking. It operates automatically without human supervision and is suitable for mass production.

Model: Marvel-LPRC-400D

Application field

Widely used in fields such as 3C electronics, optical lenses, home appliances, bathroom, construction, automotive, photovoltaic industry, etc

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